Felix Traub

Packaging SiC power semiconductors — Challenges, technologies and strategies

Umamaheswara Vemulapati, Jurgen Schuderer, Felix Traub, 2014, 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications.

A new concept of a high-current power module allowing paralleling of many SiC devices assembled exploiting conventional packaging technologies

Samuel Hartmann, Stanislav Skibin, Francisco Canales, 2016, 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

A high frequency model of toroidal chokes for EMC filtering

Bernhard Wunsch, Stanislav Skibin, Felix Traub, 2015, 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Automated Construction of Equivalent Electrical Circuit Models for Electromagnetic Components and Systems

Felix Maximilian Traub, Felix Traub, 2014 .