Weicheng Wang

A Large-Scale Identification Approach for Thermal Parameters of Multichips IGBT Modules Based on LLSO-SQP Algorithm

S. Ji, Lingyu Zhu, Yaxin Zhang, 2023, IEEE Journal of Emerging and Selected Topics in Power Electronics.

Multidimensional Mission-Profile-Based Lifetime Estimation Approach for IGBT Modules in MMC–HVdc Application Considering Bidirectional Power Transfer

F. Iannuzzo, S. Ji, Lingyu Zhu, 2023, IEEE Transactions on Industrial Electronics.

A Novel Junction Temperature Estimation Approach for High Voltage IGBT Modules Based on Pre-Turn-Off Current

Zhanlei Liu, S. Ji, Lingyu Zhu, 2022, 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE).