H. Matsumoto

Development of 300 mm TSV interposer with redistribution layers on both sides using MEMS processes

Ryutaro Maeda, Toshihiro Itoh, Miyuki Akazawa, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Development of TSV interposer with 300 mm wafer for 3D packaging

Ryutaro Maeda, Toshihiro Itoh, Miyuki Akazawa, 2013, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.