H. Chiu

Through fiber orientation investigation to visualize compression molding

R. Chang, Chih-Chung Hsu, Chao-Tsai Huang, 2014 .

Three dimensional compression molding simulation for wafer level packaging

R. Chang, Chih-Chung Hsu, W. Weng, 2013, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

3D simulation of underfill encapsulation in semiconductor processing

Chih-Chung Hsu, Rong-Yeu Chang, Hsien-Sen Chiu, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

A numerical prediction of wire crossover applying to microchip encapsulation

H. Chiu, Y. Chou, Jyh-Jer Jwo, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

A THREE-DIMENSIONAL CAE MOLDING OF MICROCHIP ENCAPSULATION

R. Chang, Chau-Kai Yu, H. Chiu, 2012 .