J. K. Hagge

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Machining Multilayer Circuit Boards: Part 1

John C. Mather, J. K. Hagge, 1984 .

Hermetic-equivalent packaging of GPS MCM-L modules for high reliability avionics applications

J. K. Hagge, R. C. Camilletti, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

State-of-the-art multichip modules for avionics

J. K. Hagge, 1991 .

State-of-the-art multichip modules for avionics

J. K. Hagge, J. Hagge, 1991 .

Mechanical considerations for reliable interfaces in next generation electronics packaging

J. K. Hagge, 1989, Proceedings of the IEEE National Aerospace and Electronics Conference.

Drilling Multilayer Glass‐PTFE Circuit Boards

J. K. Hagge, 1977 .

Hermetic-equivalent packaging of GPS MCM-L modules for high reliability avionics applications

J. K. Hagge, R. C. Camilletti, 1999 .

High-yield assembly of multichip modules through known-good IC's and effective test strategies

R. J. Wagner, J. K. Hagge, J. Hagge, 1992, Proc. IEEE.

Machining Multilayer Circuit Boards: Part 2

J. K. Hagge, John C. Mather, 1984 .

Ultra-reliable packaging for silicon-on-silicon WSI

J. K. Hagge, J. Hagge, 1988 .