Martin Anselm

Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking

Gaurang Joshi, Quang Su, James Pitarresi, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Package reliability: How can we use ideas/methods from semiconductor reliability in package reliability?

Karsten Beckmann, Patrick Justison, Matt Ring, 2017, 2017 IEEE International Integrated Reliability Workshop (IIRW).

Research opportunities in the industry: Chaired by someone not in this portion of the electronics industry…: Apologies in advance

Avyaya Jayanthinarasimham, Martin Anselm, Karsten Beckmann, 2017, 2017 IEEE International Integrated Reliability Workshop (IIRW).

Solder paste volume effects on assembly yield and reliability for bottom terminated components

Michael Meilunas, Martin Anselm, Sai Srinivas Sriperumbudur, 2017 .

Board-Level Drop Test : Comparison of Two ANSYS Modeling Approaches and Correlation with Testing

James Pitarresi, Martin Anselm, Mohammad Gharaibeh, 2013 .