文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
Frederico Goncalves de Cerqueira Lima
发表
Influence of current density on the adhesion of seedless electrodeposited copper layers on silicon
H. Leiste, U. Mescheder, C. Müller, 2019, Surface and Coatings Technology.