E. R. Pillai

Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling

E. R. Pillai, E. Pillai, 1997 .

An advanced packaging solution for OC-768, 40Gb/s utilizing ibm standard alumina MLC technology

E. R. Pillai, W. D. Dyckman, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..