David C. Whalley

Damage assessment in multilayered MEMS structures under thermal fatigue

V. Silberschmidt, D. Whalley, A. Maligno, 2011 .

Thermal Interface Materials - A Review of the State of the Art

P. Conway, D. Whalley, F. Sarvar, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly

D. Hutt, A. Al-Habaibeh, A. R. Ochana, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

David C. Whalley, Shanda Wang, Zhaoxia Zhou, 2023, ACS applied materials & interfaces.