Meng-Hsiu Tsai

In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis

Shi-Yu Huang, Ding-Ming Kwai, Cheng-Wen Wu, 2013, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Distribution of diamond grains in fixed abrasive wire sawing process

Meng-Hsiu Tsai, Chunhui Chung, C. Chung, 2014 .