Zhaowei Zhong

发表

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints

Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi, 2006, Microelectron. Reliab..

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

Zhaowei Zhong, Hun Shen Ng, Tong Yan Tee, 2003, Microelectron. Reliab..

Novel numerical and experimental analysis of dynamic responses under board level drop test

Zhaowei Zhong, Chwee Teck Lim, Jing-en Luan, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn

Zhaowei Zhong, Giovanni Frezza, Hun Shen Ng, 2003, Int. J. Comput. Eng. Sci..

Finite element analysis and experiments of ultrafine-pitch wire bonding

Zhaowei Zhong, Kay Soon Goh, 2000, Other Conferences.

Application of the moire interferometry to thermal strain analysis for electronics packaging

Zhaowei Zhong, Z. Zhong, 2003, Applications of Photonic Technology.

Design analysis of touch chip for enhanced package and board level reliability

Zhaowei Zhong, R. Bond, Hun Shen Ng, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

Zhaowei Zhong, Hun Shen Ng, Tong Yan Tee, 2006, Microelectron. Reliab..

AFM scanning moire method for nanodeformation measurement

Anand K. Asundi, Zhaowei Zhong, Huimin Xie, 2000, SPIE Optics + Photonics.

Design of micro robots with microgrippers for manipulation of micro-parts

Zhaowei Zhong, Siew Kuan Nah, 2005, International Conference on Experimental Mechanics.

High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package

Anand K. Asundi, Jin Yu, Zhaowei Zhong, 2002, Microelectron. Reliab..

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Zhaowei Zhong, Xavier Baraton, Tong Yan Tee, 2003, Microelectron. Reliab..

Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

Zhaowei Zhong, Chwee Teck Lim, Jing-en Luan, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases

Zhaowei Zhong, Meena Kishore Sakharkar, Pandjassarame Kangueane, 2006, Silico Biol..

Finite element study of flip chip on board in drop test

Zhaowei Zhong, Siew Kuan Nah, 2005, International Conference on Experimental Mechanics.

Impact life prediction modeling of TFBGA packages under board level drop test

Zhaowei Zhong, Chwee Teck Lim, Hun Shen Ng, 2004, Microelectron. Reliab..

Finite element analysis of a three‐dimensional package

Zhaowei Zhong, Peng Kiong Yip, Z. Zhong, 2003 .

Surface texture characterization using a chroma meter

Zhaowei Zhong, 2003, Applications of Photonic Technology.

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages

Zhaowei Zhong, Tong Yan Tee, 2004, Microelectron. Reliab..

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Zhaowei Zhong, Tong Yan Tee, Z. Zhong, 2004, Microelectron. Reliab..

Dynamic responses and solder joint reliability under board level drop test

Zhaowei Zhong, Chwee Teck Lim, Jing-en Luan, 2007, Microelectron. Reliab..

Simulation of the effect of adhesion and cross-sectional nonuniformity of coatings on the thermal tuning of fiber Bragg gratings

Liping Zhao, Bryan Kok Ann Ngoi, Zhaowei Zhong, 2004, SPIE Photonics Europe.

Quantitative analysis on the characteristics of targets with FDA approved drugs

Zhaowei Zhong, Kishore R. Sakharkar, Meena K. Sakharkar, 2007, International journal of biological sciences.