Xunqing Shi

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints

Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi, 2006, Microelectron. Reliab..

Dynamic bending test and simulation of PBGA packages

Guoyuan Li, Bin Xie, Xunqing Shi, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Protrusion of electroplated copper filled in through silicon vias during annealing process

Pei Chen, Bin Xie, Fei Qin, 2016, Microelectron. Reliab..

Artificial Neural Network-Based Method for Identifying Under-Inflated Tire in Indirect TPMS

Guoliang Xu, Xunqing Shi, Chao Sun, 2020, IEEE Access.

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

Xunqing Shi, Xuejun Fan, B. Xie, 2009 .

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

Xunqing Shi, Xuejun Fan, B. Xie, 2009 .

Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen

Xunqing Shi, John H. L. Pang, Z. P. Wang, 2001 .

Interfacial fracture toughness test methodology for adhesive bonded joints

Xunqing Shi, Z. P. Wang, H.L.J. Pang, 2002 .

Thermal Deformation Measurement by Digital Image Correlation Method

Xunqing Shi, J. Pang, Yaofeng Sun, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..