Kyung-Wook Paik

发表

Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die

Jinsu Kim, Seogmoon Choi, Seon Young Yu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Suk-Jin Ham, Woon-Seong Kwon, Soon-Bok Lee, 2005 .

A study on coining processes of solder bumps on organic substrates

Tae-Kyung Hwang, Kyung-Wook Paik, Jae-Woong Nah, 2003 .

High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Seungyoung Ahn, Woonghwan Ryu, Joungho Kim, 2000 .

Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system

Joungho Kim, Woonghwan Ryu, Kyung-Wook Paik, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Kyung-Wook Paik, Se-Young Jang, 2004 .

Microwave Frequency Model of FPBGA Solder Ball Extracted from S-Parameters Measurement

Seungyoung Ahn, Jun Ho Lee, Joungho Kim, 2004 .

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yi Li, Ching-Ping Wong, Kyung-Wook Paik, 2008 .

3D-TSV vertical interconnection method using Cu/SnAg double bumps

Kyung-Wook Paik, Yongwon Choi, Jiwon Shin, 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Kyung-Wook Paik, Myung Jin Yim, K. Paik, 2006 .

Development of anhydride-based NCFs for Cu/Sn-Ag eutectic bonding and process optimization for fine pitch TSV chip stacking

Ji-Won Shin, Kyung-Wook Paik, Young Soon Kim, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications

Joungho Kim, Woonghwan Ryu, Kyung-Wook Paik, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish

Yong-Min Kwon, Kyung-Wook Paik, Jeong-Tak Moon, 2007, 2007 International Conference on Electronic Materials and Packaging.

A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Shuye Zhang, Kyung-Wook Paik, K. Paik, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Jae-Woong Nah, Kyung-Wook Paik, H.-Y Son, 2005 .

Theoretical Prediction and Experimental Measurement of the Degree of Cure of Anisotropic Conductive Films (ACFs) for Chip-On-Flex (COF) Applications

Chang-Kyu Chung, Yong-Min Kwon, Kyung-Wook Paik, 2007, 2007 International Conference on Electronic Materials and Packaging.

Electromigration of Pb-Free Solder Flip Chip Using Electroless Ni-P/Au UBM

Yong-Min Kwon, Kyung-Wook Paik, K. Paik, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Frequency and Temperature Dependence of Dielectric Constant of Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate

Sung-Dong Cho, Kyung-Wook Paik, Sangyong Lee, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

A Study on Dielectric Constants of ${\rm Epoxy/SrTiO}_{3}$ Composite for Embedded Capacitor Films (ECFs)

Hyungsoo Kim, Kyung-Wook Paik, Sangyong Lee, 2007, IEEE Transactions on Advanced Packaging.

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Kiwon Lee, Kyung-Wook Paik, K. Paik, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kyung-Woon Jang, Kyung-Wook Paik, H.-Y Son, 2008, 2008 58th Electronic Components and Technology Conference.

Thermomechanical stress analysis of laminated thick-film multilayer substrates

Y. Y. Earmme, Kyung-Wook Paik, Jung-Hyung Kim, 1999 .

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Taek-Soo Kim, Ji-Won Shin, Kyung-Wook Paik, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes For High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates

Kyung-Woon Jang, Kyung-Wook Paik, Sangyong Lee, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)

Dongil Kwon, Baik-Woo Lee, Jae-Woong Nah, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications

Woon-Seong Kwon, Kyung-Wook Paik, Kijoong Kim, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates

Kyung-Wook Paik, Myung Jin Yim, K. Paik, 2006 .

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Kyung-Wook Paik, K. Paik, H. Kim, 2008, 2007 Proceedings 57th Electronic Components and Technology Conference.

Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kyung-Woon Jang, Kyung-Wook Paik, H.-Y Son, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Stresses in electroless Ni-P films for electronic packaging applications

Young-Doo Jeon, Kyung-Wook Paik, K. Paik, 2002 .

Effect of Ag Addition on the Ripening Growth of ${\rm Cu}_{6}{\rm Sn}_{5}$ Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Kyung-Wook Paik, Sun-Kyoung Seo, Hyuck-Mo Lee, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength

Oswin Ehrmann, H. Reichl, Kyung-Wook Paik, 2003 .

Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Joungho Kim, Seungyoung Ahn, Woonghwan Ryu, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems

Kyung-Wook Paik, Se-Young Jang, K. Paik, 2000, ECTC 2000.

A study on epoxy/BaTiO/sub 3/ embedded capacitor pastes for organic substrates

Kyung-Woon Jang, Kyung-Wook Paik, 2006, 56th Electronic Components and Technology Conference 2006.

Design and understanding of anisotropic conductive films (ACF's) for LCD packaging

Kyung-Wook Paik, K. Paik, M. Yim, 1997 .

Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2005 .

Investigation of various photo-patternable adhesive materials and their processing conditions for MEMS sensor wafer bonding

Kyung-Wook Paik, Jonghyun Kim, Jonghyun Kim, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates

Kyung-Wook Paik, J. S. Kim, H. S. Seo, 1999, ECTC 1999.

Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates

Kyung-Wook Paik, K. Paik, Hilyung-Jin Yim, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Characterization of U-2 wt% Mo and U-10 wt% Mo alloy powders prepared by centrifugal atomization

Kyung-Wook Paik, Chang Kyu Kim, K. Paik, 1997 .

Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints

J. O. Suh, Jae-Woong Nah, Kyung-Wook Paik, 2003 .

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability

Young-Doo Jeon, Kyung-Wook Paik, K. Paik, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2004 .

Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

Young-Doo Jeon, Kyung-Wook Paik, Myung Jin Yim, 2000 .

Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

Chang-Kyu Chung, Kyung-Wook Paik, Kyoung-Lim Suk, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs)

Kyung-Wook Paik, Heejae Lee, Sangyong Lee, 2008, 2008 58th Electronic Components and Technology Conference.

Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Woon-Seong Kwon, Kyung-Wook Paik, K. Paik, 2004 .

High reliable non-conductive adhesives for flip chip CSP applications

Kyung-Woon Jang, Jin-Sang Hwang, Woon-Seong Kwon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

High current induced failure of ACAs flip chip joint

Woon-Seong Kwon, Kyung-Wook Paik, K. Paik, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Study on the amorphous Ta2O5 thin film capacitors deposited by dc magnetron reactive sputtering for multichip module applications

Sung-Dong Cho, Kyung-Wook Paik, 1999 .

Effect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging

Kyung-Wook Paik, Jeong-Tak Moon, K. Paik, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

Woon-Seong Kwon, Kyung-Wook Paik, K. Paik, 2004 .

Embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

Chang-Kyu Chung, Kyung-Wook Paik, Kyoung-Lim Suk, 2009, 2009 59th Electronic Components and Technology Conference.

Highly reliable non-conductive adhesives for flip chip CSP applications

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2003 .

Development of three-dimensional memory die stack packages using polymer insulated sidewall technique

Kyung-Wook Paik, Hyoung Soo Ko, Joohee Kim, 2000 .

Study on epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate applications

Sung-Dong Cho, Kyung-Wook Paik, K. Paik, 2004 .

Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications

Kyung-Wook Paik, H.-Y Son, K. Paik, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Kyung-Wook Paik, Yong-Jin Park, K. Paik, 2004 .

Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moiré

Jin-Hyoung Park, Kyung-Woon Jang, Kyung-Wook Paik, 2008, 2008 10th Electronics Packaging Technology Conference.

Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

Jae-Woong Nah, Kyung-Wook Paik, Hyuck-Mo Lee, 2004 .

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Jin-Sang Hwang, Kyung-Wook Paik, Myung Jin Yim, 2007 .

Grain morphology of intermetallic compounds at solder joints

Won Kyoung Choi, Kyung-Wook Paik, Se-Young Jang, 2002 .

Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates

Kyung-Wook Paik, K. Paik, M. Yim, 2001 .

Characterization of epoxy/BaTiO3 composite embedded capacitors for high frequency behaviors

Kyung-Wook Paik, Jin-Gul Hyun, Jun So Pak, 2009, 2009 59th Electronic Components and Technology Conference.

Wafer Level ACA Packages and their Applications to Advanced Electronic Packaging

Chang-Kyu Chung, Kyung-Wook Paik, Ho-Young Son, 2008, 2008 10th Electronics Packaging Technology Conference.

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Ji-Won Shin, Kyung-Wook Paik, Yong-Won Choi, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy

H. Reichl, Sabine Nieland, Young-Doo Jeon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Joungho Kim, Seungyoung Ahn, Woonghwan Ryu, 1999 .