Tae-Sung Oh

Comparison of the thermoelectric properties of (Bi,Sb)/sub 2/Te/sub 3/ alloys prepared by powder metallurgy with single crystals

Jun-Soo Lee, Hang-Chong Kim, Tae-Sung Oh, 1998, Seventeenth International Conference on Thermoelectrics. Proceedings ICT98 (Cat. No.98TH8365).

Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint

Jae-Hoon Choi, Tae-Sung Oh, Young-Ho Kim, 2005 .

Thermoelectric properties of the bismuth–antimony–telluride and the antimony–telluride films processed by electrodeposition for micro-device applications

Tae-Sung Oh, Minyoung Kim, T. Oh, 2009 .

Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films

Tae-Sung Oh, Minyoung Kim, T. Oh, 2010 .

Low Temperature and Ultra Fine Pitch Joints Using Non-Conductive Adhesive for Flip Chip Technology

Tae-Sung Oh, Young-Ho Kim, Soo Yeol Kim, 2006, 2006 7th International Conference on Electronic Packaging Technology.

CO sensitivity of La2O3-doped SnO2 thick film gas sensor

Tae-Sung Oh, T. Oh, J. Y. Choi, 2013 .

Processing and Thermoelectric Performance Characterization of Thin-Film Devices Consisting of Electrodeposited Bismuth Telluride and Antimony Telluride Thin-Film Legs

Tae-Sung Oh, Minyoung Kim, T. Oh, 2011 .

Shear strength and aging characteristics of Sn-Pb and Sn-Ag-Bi solder bumps

Jin-Won Choi, Tae-Sung Oh, T. Oh, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).