Brian Philofsky

Seven Steps to an Accurate Worst-Case Power Analysis Using Xilinx Power Estimator (XPE)

Brian Philofsky, 2008 .

Extending Cooling Limit of Automotive Camera Advanced Driver Assistance Based Under Usage Conditions

Gamal Refai-Ahmed, Brian Philofsky, Hoa Do, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

Extending the Cooling Limit of Remote Radio Head (RRH) Systems Based on Level 1 Thermal Management

Gamal Refai-Ahmed, Brian Philofsky, Hoa Do, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

Best engineering practice for thermal characterization of stacked dice FPGA devices

Gamal Refai-Ahmed, Arun Raghupathy, Brian Philofsky, 2015, 2015 International 3D Systems Integration Conference (3DIC).

A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications

Gamal Refai-Ahmed, Brian Philofsky, Anthony Torza, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Virtex-5 FPGA System Power Design Considerations

Matt Klein, Brian Philofsky, Peggy Abusaidi, 2006 .