Karen Maex

发表

A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate

Servaas Vandenberghe, Hasan Ymeri, Bart Nauwelaers, 2002, Microprocess. Microsystems.

Efficient procedure for capacitance matrix calculation of multilayer VLSI interconnects using quasi-static analysis and Fourier series approach

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2002 .

Quasi-Static analysis of multilayer VLSI interconnects using Fourier series approach

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2003 .

Systematic analysis of energy and delay impact of very deep submicron process variability effects in embedded SRAM modules

Hua Wang, Francky Catthoor, Wim Dehaene, 2005, Design, Automation and Test in Europe.

Electrical evaluation and TEM/SEm investigation of a bottomless I-PVD Ta(N) barrier in a damascene architecture

Karen Maex, Hugo Bender, Gerald Beyer, 2000 .

DESTIN: A new approach to interconnect reliability testing

Karen Maex, Ann Witvrouw, Gerald Beyer, 1998 .

Nickel silicide Schottky-barrier detectors for short-wavelength infrared applications

Karen Maex, Jerzy M. Kurianski, J. Van Damme, 1990, Defense, Security, and Sensing.

CAD-oriented analytical solutions for capacitance and conductance of multilayer IC interconnects

Bart Nauwelaers, Karen Maex, David De Roest, 2001 .

Computation of capacitance matrix for integrated circuit interconnects using semi-analytic Green's function method

Hasan Ymeri, Bart Nauwelaers, Karen Maex, 2000, Integr..

Evaluation of the effect of process choices on reliability by the use of the isocurrent test

Karen Maex, Ann Witvrouw, Joris Proost, 1996 .

Temperature Non-Uniformities During Rapid Thermal Processing Of Patterned Wafers

Karen Maex, Peter Vandenabeele, 1990, Other Conferences.

NEW APPROACH FOR EFFICIENT COMPUTATION OF FREQUENCY-DEPENDENT SHUNT ADMITTANCE PARAMETERS OF MULTILAYER MULTICONDUCTOR IC INTERCONNECTS

Bart Nauwelaers, Karen Maex, David De Roest, 2001 .

Exploiting wiring hierarchy and system design to surpass the interconnect red brick wall

Henk Corporaal, Karen Maex, F. Catthoor, 2002 .

CAD-oriented semi analytic approach for capacitance matrix computation of multilayer VLSI interconnects

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2002 .

Methodology for propagating technology trade-offs over memory modules to the application level

Hugo De Man, Henk Corporaal, Francky Catthoor, 2003 .

Modelling the substrate skin effects in mutual RL characteristics of general asymmetric coupled interconnects

Bart Nauwelaers, Karen Maex, David De Roest, 2003 .

Impact of interconnect resistance increase on system performance of low power and high performance designs

Karen Maex, Wenqi Zhang, Michele Stucchi, 2006, SLIP '06.

On the two-dimensional capacitance calculation of multiconductor multilayered interconnects

Hasan Ymeri, Bart Nauwelaers, Karen Maex, 2001, Ann. des Télécommunications.

Effect of the depletion layer on the capacitance and inductance of MIS interconnects

Bart Nauwelaers, Karen Maex, David De Roest, 2001 .

High frequency modelling approach of on‐chip interconnects considering conductor and substrate skin effects

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2004 .

Analog and digital circuit design in 65 nm CMOS: end of the road?

Georges G. E. Gielen, Wim Dehaene, Karen Maex, 2005, Design, Automation and Test in Europe.

IMP liners for Al via speed fill

Karen Maex, Gerald Beyer, Stephen R. Daniels, 1999 .

Global interconnect trade-off for technology over memory modules to application level: case study

Hugo De Man, Henk Corporaal, Francky Catthoor, 2003, SLIP '03.

Frequency-dependent expressions for inductance and resistance of microstrip line on silicon substrate

Servaas Vandenberghe, Bart Nauwelaers, Karen Maex, 2002 .

New approach for calculation of line parameters of IC interconnects

Bart Nauwelaers, Hasan Ymeri, Karen Maex, 2001 .

Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate

Hasan Ymeri, Bart Nauwelaers, Karen Maex, 2001, Integr..

On the frequency‐dependent line capacitance and conductance of on‐chip interconnects on lossy silicon substrate

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2002 .

Plasticity of electromigration-induced hillocking

Karen Maex, Joris Proost, Lucas Delaey, 2001 .

A new approach for the calculation of line capacitances of two-layer IC interconnects

Bart Nauwelaers, Bart Nauwelaers, Karen Maex, 2000 .

Current-induced mass transport in metallic films in the near-threshold regime

Jean-Pierre Celis, Karen Maex, Joris Proost, 2003 .

Frequency-Dependent Line Capacitance and Conductance Calculations of On-Chip Interconnects on Silicon Substrate Using Fourier cosine Series Approach

Bart Nauwelaers, Servaas Vandenberghe, Hasan Ymeri, 2001 .

New modeling approach of on-chip interconnects for RF integrated circuits in CMOS technology

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2003 .

How can system level design solve the interconnect technology scaling problem?

Rudy Lauwereins, Patrick Groeneveld, Francky Catthoor, 2004, Proceedings Design, Automation and Test in Europe Conference and Exhibition.

Accurate Formulas for Frequency-Dependent Resistance and Inductance Per Unit Length of On-Chip Interconnects on Lossy Silicon Substrate

Bart Nauwelaers, Servaas Vandenberghe, Karen Maex, 2002 .

On the frequency dependent line admittance of VLSI interconnect lines on silicon based semiconductor substrates

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2002 .

Interconnect and Architecture Planning: Global interconnect trade-off for technology over memory modules to application level: case study.

Henk Corporaal, Karen Maex, F. Catthoor, 2003 .

Simple and efficient approach for shunt admittance parameters calculations of VLSI on-chip interconnects on semiconducting substrate

Servaas Vandenberghe, Hasan Ymeri, Bart Nauwelaers, 2002, Proceedings 2002 Design, Automation and Test in Europe Conference and Exhibition.

Statistically aware SRAM memory array design

Wim Dehaene, Karen Maex, Michele Stucchi, 2006, 7th International Symposium on Quality Electronic Design (ISQED'06).

IMP liners for al speed fill

Karen Maex, Gerald Beyer, Nirmalya Maity, 1998 .

Interconnect exploration for future wire dominated technologies

Hugo De Man, Henk Corporaal, Francky Catthoor, 2002, SLIP '02.

A new scaling issue in the electrical behaviour of damascene vs. plasma-etched interconnects

Karen Maex, Werner Boullart, Joris Proost, 1998 .

Electromigration in Blech-structures

Karen Maex, Joris Proost, 1999 .

A low leakage 500 MHz 2T embedded dynamic memory with integrated semi-transparent refresh

Wim Dehaene, Karen Maex, Stefan Cosemans, 2012 .

New process for the controlled formation of ultrathin PtSi films for infrared detector applications

Karen Maex, Hugo Bender, R. A Donaton, 1995, Optics & Photonics.

New closed-form expression for frequency-dependent mutual impedance of coupled interconnects on lossy silicon substrate

Bart Nauwelaers, Karen Maex, David De Roest, 2001 .

Interconnect width selection for deep submicron designs using the table lookup method

Karen Maex, Michele Stucchi, Mandeep Bamal, 2004, SLIP '04.

Approximate analytical modeling of silicon internal inductance of VLSI interconnects

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2002 .

Continued scalability of copper/low-k interconnects

Karen Maex, Wenqi Zhang, Kris Vanstreels, 2005 .

Quasi-TEM approach for shunt admittance parameters calculations of VLSI on-chip interconnects

Bart Nauwelaers, Karen Maex, David De Roest, 2003 .

CoSi2/Si1-xGex interfaces for Schottky barrier infrared detectors with extended detection regime

Karen Maex, Elisenda Roca, Matty Caymax, 1995, Optics & Photonics.

Why we need to rethink copper low-k reliability issues

Karen Maex, Guido Groeseneken, 2003 .

Frequency dependence in interline capacitance measurements

Karen Maex, Michele Stucchi, 2002, IEEE Trans. Instrum. Meas..

Simply irresistible silicides

Karen Maex, K. Maex, 1995 .

Session details: Interconnect Exploration for Future Wire Dominated Technologies

Karen Maex, F. Catthoor, H. Corporaal, 2002, SLIP '02.

The control and impact of processing ambient during rapid thermal processing

Karen Maex, Joris Proost, Paul R. Besser, 1998 .

Silicides for the 100-nm node and beyond: Co-silicide, Co(Ni)-silicide and Ni-silicide

Karen Maex, Christa Vrancken, Annick Lauwers, 2002 .

Silicides for integrated circuits: TiSi2 CoSi2

Karen Maex, K. Maex, 1993 .

Plasma sealing of a low-K dielectric polymer

Jean-Pierre Celis, Karen Maex, K. Maex, 2004 .

Broadband impedance parameters of symmetric coupled coplanar CMOS interconnects

Bart Nauwelaers, Karen Maex, David De Roest, 2003 .

Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects

Karen Maex, Steven Demuynck, Francesca Iacopi, 2004 .

Impact of current crowding on electromigration-induced mass transport

Karen Maex, C. Bruynseraede, K. Maex, 2004 .

Low dielectric constant materials for microelectronics

Karen Maex, Denis Shamiryan, Sywert Brongersma, 2003 .

Dielectric Films for Advanced Microelectronics

Karen Maex, K. Maex, M. Baklanov, 2007 .

Impact of Ni-silicide grain orientation on the strain and stress fields induced in patterned silicon

Karen Maex, Hugo Bender, Jorge Kittl, 2007 .

Ni silicide morphology on small features

Karen Maex, Jorge Kittl, Muriel de Potter de ten Broeck, 2004 .

In situ transmission electron microscopy study of Ni silicide phases formed on (001) Si active lines

Karen Maex, Hugo Bender, An Steegen, 2001 .

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

Karen Maex, Nancy Heylen, Gerald Beyer, 2005 .

A global view of interconnects

Karen Maex, Michele Stucchi, Mandeep Bamal, 2006 .

NEW ANALYTIC FORMULAS FOR SERIES MUTUAL IMPEDANCE COMPONENT CALCULATIONS OF COUPLED INTERCONNECTS ON LOSSY SILICON SUBSTRATE

Bart Nauwelaers, Karen Maex, David De Roest, 2001 .

Use of a capacitance voltage technique to study copper drift diffusion in (porous) inorganic low-k materials

Karen Maex, K. Maex, F. Lanckmans, 2002 .

Add-on Cu/SiLK™ Module for High Inductors

Bart Nauwelaers, Karen Maex, Stefaan Decoutere, 2002 .

Porous low dielectric constant materials for microelectronics

Karen Maex, K. Maex, M. Baklanov, 2006, Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences.

Electromigration study of sub-100nm Cu-lines

Philippe Roussel, Karen Maex, J. Michelon, 2004 .

Fast and accurate analysis of the multiconductor interconnects

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2000 .

Optimized thermal processing for Ti-capped CoSi 2 for 0.13 mm technology

Karen Maex, Christa Vrancken, Annick Lauwers, 2001 .

Effects of alloying on properties of NiSi for CMOS applications

Karen Maex, Jorge Kittl, J. Kittl, 2004 .

Distributed inductance and resistance per unit length formulas for VLSI interconnects

Bart Nauwelaers, Servaas Vandenberghe, Karen Maex, 2001 .

Electromigration threshold in damascene versus plasma-etched interconnects

Karen Maex, Joris Proost, Lucas Delaey, 1998 .

Impact of line-edge roughness on resistance and capacitance of scaled interconnects

Karen Maex, Michele Stucchi, Mandeep Bamal, 2007 .

Compressive stress relaxation through buckling of a low-k polymer-thin cap layer system

Karen Maex, Sywert Brongersma, Francesca Iacopi, 2003 .

Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation

Karen Maex, Eric P. Guyer, B. Eyckens, 2006 .

Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection

Karen Maex, Frank Holsteyns, Paul Mertens, 2003 .

Development of a hexagonal-shaped rapid thermal processor using a vertical tube

Karen Maex, Byung Jin Cho, Peter Vandenabeele, 1994 .

Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions

Karen Maex, M. Van Hove, Sywert Brongersma, 2004 .

Damage minimized plasma pore sealing of microporous low k dielectrics

Karen Maex, K. Maex, Thomas Abell, 2004 .

Influence of temperature and backside roughness on the emissivity of Si wafers during rapid thermal processing

Karen Maex, Peter Vandenabeele, P. Vandenabeele, 1992 .

Diffusion of solvents in thin porous films

Karen Maex, Denis Shamiryan, W. Boullart, 2007 .

The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal lines

Karen Maex, V. D'Haeger, W. De Ceuninck, 1998 .

Silicide-induced stress in Si: origin and consequences for MOS technologies

Karen Maex, An Steegen, A. Steegen, 2002 .

Impurity Incorporation during Copper Electrodeposition in the Curvature-Enhanced Accelerator Coverage Regime

Karen Maex, Wilfried Vandervorst, M. Van Hove, 2005 .

CoSi2: An attractive alternative to TiSi2

Karen Maex, 1995 .

The influence of Ti capping layers on CoSi 2 formation

Karen Maex, Christophe Detavernier, C. Detavernier, 1999 .

Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma

Karen Maex, Denis Shamiryan, Serge Vanhaelemeersch, 2002 .

A thermal stability study of alkane and aromatic thiolate self-assembled monolayers on copper surfaces

Karen Maex, Laure Carbonell, Caroline Whelan, 2004 .

Reaction of trimethylchlorosilane in spin-on Silicalite-1 zeolite film.

Karen Maex, Francesca Iacopi, F. Iacopi, 2008, Langmuir : the ACS journal of surfaces and colloids.

Properties of metal silicides

Karen Maex, Inspec, Marc Van Rossum, 1995 .

Feasibility study of electroless copper deposition for VLSI

Karen Maex, K. Maex, R. Palmans, 1991 .

Influence of low-k dry etch chemistries on the properties of copper and a Ta-based diffusion barrier

Karen Maex, Herbert Struyf, Francesca Iacopi, 2003 .

Impact of Patterned Layers on Temperature Non-Uniformity during Rapid Thermal Processing for VLSI-Applications

Karen Maex, R. F. De Keersmaecker, P. Vandenabeele, 1989 .

Internal photoemission of electrons at interfaces of metals with low-κ insulators

Guido Groeseneken, Karen Maex, Andre Stesmans, 2006 .

Electrical Equivalent Sidewall Damage in Patterned Low-k Dielectrics

Karen Maex, Michele Stucchi, Olivier Richard, 2004 .

Electromigration-induced drift in damascene and plasma-etched Al(Cu). I. Kinetics of Cu depletion in polycrystalline interconnects

Karen Maex, Ann Witvrouw, Joris Proost, 2000 .

Low-k dielectric materials

Karen Maex, Denis Shamiryan, Francesca Iacopi, 2004 .

Wafer thermal desorption spectrometry in a rapid thermal processor using atmospheric pressure ionization mass spectrometry

Karen Maex, Marc Heyns, Eiichi Kondoh, 2000 .

Barrier studies on porous silk semiconductor dielectric

Karen Maex, Bencherki Mebarki, Francesca Iacopi, 2003 .

Influence of the electron mean free path on the resistivity of thin metal films

Karen Maex, Bert Brijs, Ludo Froyen, 2004 .

Processing damage and electrical performance of porous dielectrics in narrow spaced interconnects

Karen Maex, Herbert Struyf, Michele Stucchi, 2004 .

On the modelling of multiconductor multilayer systems for interconnect applications

Bart Nauwelaers, Karen Maex, Hassan Ymeri, 2001 .

Growth and characterization of atomic layer deposited WC0.7N0.3 on polymer films

Jean-Pierre Celis, Karen Maex, Denis Shamiryan, 2004 .

Leakage optimization of ultra-shallow junctions formed by solid phase epitaxial regrowth

Karen Maex, Wilfried Vandervorst, Jorge Kittl, 2004 .

Studies of Copper Surfaces modified by Thermal and Plasma Treatments

Karen Maex, Gerald Beyer, Mikhail R. Baklanov, 2000 .

Microtexture and electromigration-induced drift in electroplated damascene Cu

Jean-Pierre Celis, Karen Maex, Joris Proost, 2000 .

Influence of absorbed water components on SiOCH low-k reliability

Guido Groeseneken, Karen Maex, Ivan Ciofi, 2008 .

Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Karen Maex, Zsolt Tokei, R. Jonckheere, 2004 .

Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity

Karen Maex, Dagang Li, Sywert Brongersma, 2007 .

Dry oxidation mechanisms of copper in trenches

Karen Maex, Bert Verlinden, M. Van Hove, 2002 .

Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

Karen Maex, Caroline Whelan, Hong Meng Ho, 2003 .

Comparative study of PECVD SiOCH low-k films obtained at different deposition conditions

Karen Maex, Denis Shamiryan, Serge Vanhaelemeersch, 2002 .

Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects

Karen Maex, Georg Tempel, Gerald Beyer, 2002 .

Factors affecting an efficient sealing of porous low-k dielectrics by physical vapor deposition Ta(N) thin films

Karen Maex, Denis Shamiryan, Bert Brijs, 2002 .