A. Scott Lawing

A Predictive Model for Controlling Wafer Level Polish Rate Uniformity in Oxide CMP

Tushar P. Merchant, Leonard J. Borucki, A. Scott Lawing, 2005 .

Pad Conditioning and Pad Surface Characterization in Oxide Chemical Mechanical Polishing

A. Scott Lawing, A. S. Lawing, 2002 .