Bing Dang

发表

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, 2008, IBM J. Res. Dev..

Integrated Input/Output Interconnection and Packaging for GSI

Bing Dang, B. Dang, 2006 .

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

Muhannad S. Bakir, Gang Huang, James D. Meindl, 2008, 2008 IEEE Custom Integrated Circuits Conference.

Three-Dimensional Chip Stack With Integrated Decoupling Capacitors and Thru-Si Via Interconnects

Bing Dang, M Shapiro, P Andry, 2010, IEEE Electron Device Letters.

3D chip stacking with C4 technology

Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, 2008, IBM J. Res. Dev..

Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

Muhannad S. Bakir, James D. Meindl, Bing Dang, 2007, 2007 IEEE Custom Integrated Circuits Conference.

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, 2008, IBM J. Res. Dev..

Lead Free Micro Bumping - Cost & Yield Challenges

Bing Dang, Da-Yuan Shih, K. Ruhmer, 2007, 2007 9th Electronics Packaging Technology Conference.

Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems

Bing Dang, M.S. Bakir, C. King, 2008, 2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference.

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

Keith A. Jenkins, Alina Deutsch, Paul S. Andry, 2005, IBM J. Res. Dev..

Boiling sensitivity analysis of asymmetrically heated micro-scale devices

Pritish R. Parida, Bing Dang, Mark D. Schultz, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects

Yong Liu, Xiaoxiong Gu, Herschel A. Ainspan, 2012, IEEE Journal of Solid-State Circuits.

NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing

Hongmei Ren, Pinhua Xie, Zhaokun Hu, 2020, Remote. Sens..

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors

Luca P. Carloni, Kenneth L. Shepard, Paul S. Andry, 2015, 2015 Symposium on VLSI Circuits (VLSI Circuits).

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Pritish R. Parida, Cornelia K. Tsang, Bing Dang, 2015 .

Three-dimensional silicon integration

Katsuyuki Sakuma, Anna W. Topol, Paul S. Andry, 2008, IBM J. Res. Dev..

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors

Luca P. Carloni, Bing Dang, Noah Sturcken, 2015, 2015 Symposium on VLSI Technology (VLSI Technology).

Chip integration of Sea of Leads compliant I/O interconnections for the ultimate enabling of chips with low-k interlayer dielectrics

Bing Dang, R. Emery, J.D. Meindl, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Factors in the selection of temporary wafer handlers for 3D/2.5D integration

Bing Dang, John Knickerbocker, Paul Andry, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Pritish R. Parida, Cornelia K. Tsang, Bing Dang, 2016 .

`Trimodal' Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O Interconnects

Bing Dang, J. Meindl, B. Dang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration

Bing Dang, Robert Trzcinski, John Knickerbocker, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

50μm pitch Pb-free micro-bumps by C4NP technology

Bing Dang, Da-Yuan Shih, K. Ruhmer, 2008, 2008 58th Electronic Components and Technology Conference.