Gyujei Lee

Mechanical characterization of residual stress around TSV through instrumented indentation algorithm

Gyujei Lee, Suk-woo Jeon, Kwang-yoo Byun, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Interfacial reliability and micropartial stress analysis between TSV and CPB through NIT and MSA

Dongil Kwon, Gyujei Lee, Suk-woo Jeon, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).