Cheung-Wei Lam

Three-dimensional modeling of multichip module interconnects

Cheung-Wei Lam, S. M. Ali, P. Nuytkens, 1993 .

EMI prediction in switched power supplies by full-wave and non-linear circuit co-simulation

Keong Kam, David Pommerenke, Xin Chang, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

Quantifying EMI resulting from finite-impedance reference planes

Todd H. Hubing, Fei Sha, T. P. Van Doren, 1997 .

An evaluation of TVS devices for ESD protection

Keong Kam, Zhen Li, D. Pommerenke, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.