Min-Hua Chung

Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review

H. Takiar, C. Gan, Min-Hua Chung, 2023, Journal of Materials Science: Materials in Electronics.

Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review

H. Takiar, C. Gan, Min-Hua Chung, 2023, Journal of Materials Science: Materials in Electronics.