R. D. Gerke

Recommendation regarding package related tests

R. D. Gerke, J. Plante, 2003 .

Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors

R. D. Gerke, G. B. Kromann, 1999 .

Use of commercial off-the-shelf (COTS) for space applications

R. D. Gerke, A. A. Shapiro, 2003 .

Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array

R. D. Gerke, S. Mattay, D. R. Banks, 1994, Proceedings of the International Conference on Multichip Modules.

Reliability comparison of two metallurgies for ceramic ball grid array

R. D. Gerke, S. Mattay, D. R. Banks, 1995 .