Junichi Koike

发表

Multiple phase change structure for the scalable phase change random access memory array

Yun-Heub Song, Jung Min Lee, Yuta Saito, 2014 .

Manufacturing and Construction, Operation of Karita PFBC 360 MW Unit

Hajime Watanabe, Shinobu Nakamura, Junichi Koike, 2003 .

MEMS/NEMS Devices and Materials Development

Junichi Koike, Kazuki Takashima, Kaneaki Tsuzaki, 2002 .

Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn∕SiO2 interface

Junichi Koike, K. Neishi, J. Koike, 2007 .

Structural and residual stress changes in Mo/a-Si multilayer thin films with annealing

M. E. Kassner, Michael E. Kassner, Junichi Koike, 1996 .

Formation of a manganese oxide barrier layer with thermal chemical vapor deposition for advanced large-scale integrated interconnect structure

Hitoshi Itoh, Hiroshi Sato, Junichi Koike, 2008 .

Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

Sehoon Yoo, Jeong-Won Yoon, Junichi Koike, 2016, Journal of Electronic Materials.

Chemical Vapor Deposition of Mn and Mn Oxide and their Step Coverage and Diffusion Barrier Properties on Patterned Interconnect Structures

Hitoshi Itoh, Hiroshi Sato, Junichi Koike, 2009 .

Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV

Mitsumasa Koyanagi, Takafumi Fukushima, Mariappan Murugesan, 2014, IEEE Electron Device Letters.

Microstructural influences on stress migration in electroplated Cu metallization

Kouichi Maruyama, Junichi Koike, K. Maruyama, 2003 .

Grain-Boundary Sliding in AZ31 Magnesium Alloys at Room Temperature to 523 K

T. Kobayashi, Kouichi Maruyama, Junichi Koike, 2003 .

Stress Relaxation during Isothermal Annealing at Elevated Temperatures in Electroplated Cu Films

Young-Chang Joo, Junichi Koike, Soo-Jung Hwang, 2003 .

Inverse Resistance Change Cr2Ge2Te6-Based PCRAM Enabling Ultralow-Energy Amorphization.

Daisuke Ando, Yuta Saito, Yuji Sutou, 2018, ACS Applied Materials and Interfaces.

Co and CoTix for contact plug and barrier layer in integrated circuits

Daisuke Ando, Yuji Sutou, Junichi Koike, 2018 .

Contact resistance change memory using N-doped Cr2Ge2Te6 phase-change material showing non-bulk resistance change

Daisuke Ando, Yi Shuang, Yuji Sutou, 2018 .

Void formation by thermal stress concentration at twin interfaces in Cu thin films

Masumi Saka, Kouichi Maruyama, S. Kamiya, 2001 .

Amorphous Co-Ti alloy as a single layer barrier for Co local interconnect structure

Larry Zhao, Yuji Sutou, Junichi Koike, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Optical contrast and laser-induced phase transition in GeCu2Te3 thin film

Yuta Saito, Yuji Sutou, Junichi Koike, 2013 .

Stress relaxation during isothermal annealing in electroplated Cu films

Young-Chang Joo, Junichi Koike, Soo-Jung Hwang, 2008 .

Strengthening Mechanisms of Creep Resistant Tempered Martensitic Steel

Kouichi Maruyama, Junichi Koike, K. Sawada, 2001 .

Phase Change Characteristics in GeTe–CuTe Pseudobinary Alloy Films

Yuta Saito, Yuji Sutou, Junichi Koike, 2014 .

Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon

Hiroshi Oikawa, Kouichi Maruyama, Junichi Koike, 1998 .

Self-forming diffusion barrier layer in Cu–Mn alloy metallization

Junichi Koike, M. Wada, J. Koike, 2005 .