Feng Lin

Bonding mechanisms and electrical properties of Ge/Si and Si/Si bonded wafers achieved by thin microcrystalline Ge interlayer

Rongfei Wang, Chong Wang, S. Ke, 2023, Journal of Alloys and Compounds.

Te doping effects on the ferromagnetic performance of the MnGe/Si quantum dots grown by ion beam sputtering deposition

S. Ye, Feng Lin, Xiaoxiao Duan, 2023, Journal of Alloys and Compounds.