Keith Sweatman

Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Richard J. Coyle, Keith Sweatman, Babak Arfaei, 2017 .

iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components

Xiaodong Jiang, Keith Sweatman, Rita Mohanty, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Hot Air Solder Leveling in the Lead-free Era

Keith Sweatman, 2006 .

Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics

Stuart D. McDonald, Kazuhiro Nogita, Keith Sweatman, 2014, 2014 International Conference on Electronics Packaging (ICEP).

Microstructure Control in Sn-0.7 mass%Cu Alloys

Tetsuro Nishimura, Kazuhiro Nogita, Arne K. Dahle, 2005 .

Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

Richard Coyle, Ning-Cheng Lee, Keith Sweatman, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Richard J. Coyle, Keith Sweatman, Babak Arfaei, 2015 .