W.D. Becker

T-Rex, a blade packaging architecture for mainframe servers

G.A. Katopis, W.D. Becker, H.H. Harrer, 2005, IEEE Transactions on Advanced Packaging.

On chip circuit model for accurate mid-frequency simultaneous switching noise prediction

Tingdong Zhou, W.D. Becker, T. Strach, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

The importance of inductance and inductive coupling for on-chip wiring

A. Deutsch, G.A. Katopis, G.V. Kopcsay, 1997, Electrical Performance of Electronic Packaging.

Behavioral models of pre-compensation driver and dynamic termination receiver for packaging system timing and coupled noise simulations

Zhaoqing Chen, G. Katopis, W.D. Becker, 2002, Electrical Performance of Electronic Packaging,.

Power distribution analysis for IBM eServer system integration optimization

Tingdong Zhou, A. Huber, W.D. Becker, 2004, Electrical Performance of Electronic Packaging - 2004.

When are transmission-line effects important for on-chip interconnections

K.A. Jenkins, G.V. Kopcsay, C.W. Surovic, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

S/390 cost performance considerations for packaging choices

G.A. Katopis, W.D. Becker, 1997, Electrical Performance of Electronic Packaging.