C. Lung

Three-Dimensional Integrated Circuits Design for Thousand-Core Processors: From Aspect of Thermal Management

Ding-Ming Kwai, Shih-Chieh Chang, Yung-Fa Chou, 2012 .

Design and implementation of 3D-thermal test chip for exploration of package effects

Yung-Fa Chou, D. Kwai, Shih-Chieh Chang, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons

Ding-Ming Kwai, Shih-Chieh Chang, Ping-Hei Chen, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Floorplanning 1024 cores in a 3D-stacked networkon- chip with thermal-aware redistribution

Ding-Ming Kwai, Yung-Fa Chou, Chin-Chi Hsu, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Soft-Error-Tolerant Design Methodology for Balancing Performance, Power, and Reliability

Wen-Ben Jone, Tien-Fu Chen, Shih-Chieh Chang, 2015, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.