Albert T. Wu

Reliability of micro-interconnects in 3D IC packages

Yi-Shao Lai, King-Ning Tu, C. Robert Kao, 2013, Microelectron. Reliab..

The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment

Y. C. Ding, Albert T. Wu, Y. Ding, 2009, Microelectron. Reliab..

Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni

Albert T. Wu, King-Ning Tu, Nobumichi Tamura, 2011 .

Crystallographic Orientation Effect on Electromigration in Ni-Sn Microbump

Albert T. Wu, Subhendu Chakroborty, Chih-hao Chen, 2017, JOM.

Stress analysis of spontaneous Sn whisker growth

Albert T. Wu, King-Ning Tu, K. Tu, 2006 .

Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads

Albert T. Wu, King-Ning Tu, K. Tu, 2007 .