Bruce Guenin

发表

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package

Jing Shi, Theresa Sze, Darko Popovic, 2010, Microelectron. Reliab..

SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM

Bruce Guenin, John Perry, Marcelle Ibrahim, 1995 .

Low-power thermal tuning of SOI-CMOS photonic structures

Xuezhe Zheng, Guoliang Li, Bruce Guenin, 2011, OPTO.

Evening tutorial: The Internet of Things — A personal perspective

Bruce Guenin, 2018 .

Mechanical analysis and reliability enhancement of a Proximity Communication flip chip package

Bruce Guenin, Jing Shi, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Challenges in building a flat-bandwidth memory hierarchy for a large-scale computer with proximity communication

Ashok V. Krishnamoorthy, Ron Ho, Robert J. Drost, 2005, 13th Symposium on High Performance Interconnects (HOTI'05).

Compact, thermally-tuned resonant ring muxes in CMOS with integrated backside pyramidal etch pit

Ashok V. Krishnamoorthy, Xuezhe Zheng, Ying Luo, 2011, 2011 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference.