Tai-Hung Chen

中文商業名片辨識及後處理; Recognition and Postprocessing of Chinese Business Cards

陳泰宏, Tai-Hung Chen, 2000 .

Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

Kuo-Shu Kao, Ren-Shin Cheng, Tsung-Fu Yang, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Automatic Learning of Context-Free Grammar

Chia-Ping Chen, Tai-Hung Chen, Chun-Han Tseng, 2006, ROCLING/IJCLCLP.

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.