M. Mahalingam

Relative figures of merit for potential chip-to-MCM substrate interconnection methods for CMOS and ECL multichip packaging

U. A. Shrivastava, W. Valentine, M. Mahalingam, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Electrical packaging requirements for low voltage ICs-3.3 V High Performance CMOS devices as a case study

R. Senthinathan, M. Mahalingam, A. Mehra, 1993, Proceedings of IEEE Electrical Performance of Electronic Packaging.

Relative figures of merit for chip-to-MCM substrate interconnection methods

U. A. Shrivastava, M. Mahalingam, W. Valetine, 1993 .

Thermal performance limits of the QFP family

B. Chambers, Howard M. Berg, V. Hause, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

A TEM-cell based method for radiative susceptibility characterization of low-power microcontrollers

M. Mahalingam, H. Astrain, A. Engel, 1996, Proceedings of Symposium on Electromagnetic Compatibility.

Application of a CFD tool for system-level thermal simulation

Tien-Yu Tom Lee, M. Mahalingam, T. Lee, 1993 .