C. Tan

Contact resistance measurement of bonded copper interconnects for three-dimensional integration technology

A. Fan, R. Reif, K. Chen, 2004, IEEE Electron Device Letters.

Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2005 .

Bonding parameters of blanket copper wafer bonding

Kuan-Neng Chen, A. Fan, C. S. Tan, 2006 .