J. H. Lau

发表

Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Heng-Chieh Chien, J. H. Lau, Yu-Lin Chao, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Electrical design of a cost-effective thermal enhanced plastic ball grid array package-NuBGA

Tai-Yu Chou, J. H. Lau, J. Lau, 1998 .

Electrical characterization of through silicon vias (TSVs) with an on chip bus driver for 3D IC integration

J. H. Lau, M. J. Kao, S. S. Sheu, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Solder joint reliability of a low cost chip size package—NuCSP

J. H. Lau, J. Lau, 1998 .

Proceedings of the fifth international conference on CANDU fuel. V.1,2

J. H. Lau, 1997 .

Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions

J. H. Lau, J. Lau, 1996 .

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

J. H. Lau, Chris Chang, S. W. Ricky Lee, 2000 .

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Kuo-Shu Kao, Tao-Chih Chang, Ren-Shin Cheng, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Design, analysis, and measurement of a cost effective plastic ball grid array package : NuBGA

J. H. Lau, T.-Y. Chou, T. Chen, 1998 .

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

J. H. Lau, C. Chang, S.-W.R. Lee, 2000 .

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

J. H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

J. H. Lau, S. W. Ricky Lee, J. Lau, 2000 .

Critical issues of wafer level chip scale package (WLCSP) with emphasis on cost analysis and solder joint reliability

J. H. Lau, 2002 .

Thermal stress analysis of tape automated bonding packages and interconnections

J. H. Lau, D. Rice, J. Lau, 1989, Proceedings., 39th Electronic Components Conference.

Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Creep analysis of solder bumped direct chip attach (DCA) on microvia build-up printed circuit board with underfill

J. H. Lau, J. Lau, S. H. Pan, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Taguchi design of experiment for wafer bumping by stencil printing

J. H. Lau, C. Chang, 2000, ECTC 2000.

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions

J. H. Lau, J. Lau, J. Lau, 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

A. Kumar, D. Pinjala, J. H. Lau, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

J. H. Lau, J. Lau, 1989 .

Vibration Frequencies of Tapered Bars With End Mass

J. H. Lau, 1984 .

Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12" (300mm) wafer for 3D IC Integration

J. H. Lau, M. Brillhart, Li Li, 2011 .

Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

How to select underfill materials for solder bumped flip chips on low cost substrates

J. H. Lau, J. Lau, C. Chang, 1998 .

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Vibration frequencies for a non-uniform beam with end mass

J. H. Lau, 1984 .

The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies

J. H. Lau, J. Lau, 1997 .

Vibration Frequencies and Mode Shapes for a Constrained Cantilever

J. H. Lau, J. Lau, 1984 .

Characterization of underfill materials for functional solder bumped flip chips on board applications

J. H. Lau, J. Lau, C. Chang, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Failure analysis of solder bumped flip chip on low-cost substrates

J. H. Lau, J. Lau, S. Lee, 2000 .

Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack

A. Kumar, J. H. Lau, V. Kripesh, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thin Wafer Handling of 300mm Wafer for 3D IC Integration

J. H. Lau, Hsiang-Hung Chang, Y. H. Chen, 2011 .

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

J. H. Lau, Thomas H. Baker, J. Lau, 1996 .

How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?

J. H. Lau, M. Kao, J. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

D. Pinjala, J. H. Lau, V. Kripesh, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability

J. H. Lau, D. Rice, J. Kral, 1988 .

Effects of underfill delamination and chip size on the reliability of solder bumped Flip Chip on board

J. H. Lau, Chien Ouyang, C. Ouyang, 1999 .