Ming-Ji Dai

发表

Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Heng-Chieh Chien, J. H. Lau, Yu-Lin Chao, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)

Sheng-Tsai Wu, John H. Lau, T.-H. Chen, 2011 .

Non-refrigerant thermoelectric air conditioning technique on vehicles

Heng-Chieh Chien, Ming-Ji Dai, Ra-Min Tain, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Evaluation of Temperature-Dependent Effective Material Properties and Performance of a Thermoelectric Module

Sheng-Tsai Wu, Heng-Chieh Chien, Ming-Ji Dai, 2013, Journal of Electronic Materials.

Electro-thermal finite element analysis and verification of power module with aluminum wire

Kuo-Ning Chiang, Ming-Ji Dai, Tuan-Yu Hung, 2014 .

Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound

Kuo-Ning Chiang, Ming-Ji Dai, Chun-Kai Liu, 2014 .

Estimation for equivalent thermal conductivity of silicon-through vias TSVs used for 3D IC integration

John H. Lau, Heng-Chieh Chien, Ming-Ji Dai, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Thermo-mechanical analysis of thermoelectric modules

Sheng-Tsai Wu, Ming-Ji Dai, Ming-Che Hsieh, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

A thermal performance measurement method for blind through silicon vias (TSVs) in a 300mm wafer

John H. Lau, Heng-Chieh Chien, Ming-Ji Dai, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

High efficiency silicon-based high power LED package integrated with micro- thermoelectric device

Ming-Ji Dai, Chun Kai Liu, M. Dai, 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.

Characteristics of Thermal Resistance for High Power LEDs

Heng-Chieh Chien, Ming-Ji Dai, Chun-Kai Liu, 2008, 2008 10th Electronics Packaging Technology Conference.

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

Sheng-Tsai Wu, John H. Lau, Heng-Chieh Chien, 2011 .