V. Srinivasan

A novel approach to characterize trench depth and profile using the 3D tilt capability of a critical dimension-scanning electron microscope at 65nm technology mode

R. Srivastava, R. Peltinov, V. Srinivasan, 2006, SPIE Advanced Lithography.

Experimental investigation and manufacturing solution of the rapid thermal process induced overlay residue

O. Vatel, P. Benyon, B. Krishnan, 2012, 2012 SEMI Advanced Semiconductor Manufacturing Conference.