J. van den Brand

Novel methodology to integrate ultra-thin chips on flexible foils

A. Sridhar, M. Cauwe, R. H. L. Kusters, 2012, 2012 4th Electronic System-Integration Technology Conference.

The electro-thermal-mechanical performance of an OLED: A multi-physics model study

M. Barink, J. van den Brand, A.W.J. Gielen, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Novel interconnect methodologies for ultra-thin chips on foils

M. Cauwe, R. H. L. Kusters, J. van den Brand, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.