Di Jiang

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

K. Jeppson, Shuangxi Sun, M. Edwards, 2017, 2017 International Conference of Microelectronic Test Structures (ICMTS).

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

K. Jeppson, Di Jiang, Lilei Ye, 2012, IEEE Electron Device Letters.

Experimental study on electrical properties and stability of CNT bumps in high density interconnects

Johan Liu, Yifeng Fu, Ying Zhou, 2013, 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).

Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires

Di Jiang, Nan Wang, Lilei Ye, 2015 .

Reliability of carbon nanotube bumps for chip on glass application

Johan Liu, Yifeng Fu, Shirong Huang, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

Johan Liu, L. Ye, Si Chen, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Carbon nanotubes for electronics manufacturing and packaging: from growth to integration

Teng Wang, Johan Liu, Yifeng Fu, 2013 .

A Novel Hybrid Poly (vinyl alcohol) (PVA)/Poly (2,6-dimethyl-1,4-phenylene oxide) (PPO) Membranes for Reverse Electrodialysis Power System

Bopeng Zhang, Yongsheng Chen, J. Hong, 2017 .