H. Kino

Ultrafast parallel reconfiguration of 3D-stacked reconfigurable spin logic chip with on-chip SPRAM (SPin-transfer torque RAM)

H. Ohno, M. Koyanagi, K. Kiyoyama, 2012, 2012 Symposium on VLSI Technology (VLSIT).

New heterogeneous multi-chip module integration technology using self-assembly method

M. Koyanagi, K. Kiyoyama, K.-W. Lee, 2008, 2008 IEEE International Electron Devices Meeting.

Plasma assisted multichip-to-wafer direct bonding technology for self-assembly based 3D integration

M. Koyanagi, H. Kino, M. Murugesan, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Cu lateral interconnects formed between 100-µm-thick self-assembled chips on flexible substrates

M. Koyanagi, K. Kiyoyama, H. Kino, 2009, 2009 59th Electronic Components and Technology Conference.