Chun-feng Yang

Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon

Lei Zhang, Longxu Yao, Qianqing Jiang, 2020, Semiconductor Science and Technology.

Analysis of crack initiation load and stress field in double scratching of single crystal gallium nitride

Qianqing Jiang, Chunfeng Yang, Lei Zhang, 2022, Engineering Fracture Mechanics.

An analytical model for estimation of the stress field and cracks caused by scratching anisotropic single crystal gallium nitride

Lei Zhang, Qianqing Jiang, Chunfeng Yang, 2021 .

Adsorption of Ag on M-doped graphene: First principle calculations

Kun Zhang, Jianyi Liu, Chunfeng Yang, 2021, International Journal of Minerals, Metallurgy and Materials.

Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon

Chun-feng Yang, Keying Wang, Yufei Gao, 2024, Materials.

Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon

Yufei Gao, Chunfeng Yang, Dameng Cheng, 2022, Materials Science in Semiconductor Processing.

Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon

Yufei Gao, Chunfeng Yang, Yihe Liu, 2021, Diamond and Related Materials.