J. L. Prince

发表

Efficient design/simulation algorithms for simultaneous switching noise in leadframe packages

C. Huang, L. Lin, J. L. Prince, 1997 .

Electronic packaging education in an interdisciplinary, cooperative research environment

J. L. Prince, Andreas C. Cangellaris, Olgierd A. Palusinski, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Investigation of reliability attributes and accelerated stress factors of terrestrial solar cells. Second quarterly report, March 9, 1978--June 9, 1978

J. L. Prince, J. W. Lathrop, 1978 .

Comparison of driver models for the computer-aided analysis of electronic packages

J. L. Prince, S. N. Pratapneni, C. M. Wolff, 1993, Proceedings of IEEE Electrical Performance of Electronic Packaging.

An all purpose dispersive multiconductor interconnect model compatible with PRIMA

J. L. Prince, Andreas C. Cangellaris, S. Pasha, 2000, ECTC 2000.

SSO noise electrical performance limitations for PQFP packages

J. L. Prince, Lei Lin, 1997 .

Crosstalk analysis for high-speed pulse propagation in lossy electrical interconnections

J. L. Prince, S. Voranantakul, P. Hsu, 1993 .

Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems

Andreas C. Cangellaris, J. L. Prince, L. P. Vakanas, 1989 .

A new discrete transmission line model for passive model order reduction and macromodeling of high-speed interconnections

J. L. Prince, Andreas C. Cangellaris, S. Pasha, 1999 .

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

Tribikram Kundu, J. L. Prince, Chandra S. Desai, 1997 .

Electrical performance evaluation for multi-chip assemblies using knowledge based approach

Jerzy W. Rozenblit, J. L. Prince, R. Senthinathan, 1992, [1992 Proceedings] Electrical Performance of Electronic Packaging.

Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

J. L. Prince, K. L. Virga, M. Elzinga, 2000 .

Electrical performance analysis of packaged CMOS ASIC devices and systems

J. L. Prince, R. Senthinathan, 1992, [1992] Proceedings. Fifth Annual IEEE International ASIC Conference and Exhibit.

SSO noise electrical performance limitations for PQFP packages

J. L. Prince, Lei Lin, 1996 .

Effects of discontinuities (vias) on high speed interconnects

J. L. Prince, Andreas C. Cangellaris, S. Venkataraman, 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

S-parameter VLSI transmission line analysis

Andreas C. Cangellaris, J. L. Prince, Olgierd A. Palusinski, 1989, Proceedings., 39th Electronic Components Conference.

Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design

J. L. Prince, Andreas C. Cangellaris, Cheng Jiao, 2000 .

Reference plane parasitics modeling and their contribution to the power and ground path

Andreas C. Cangellaris, J. L. Prince, Ramesh Senthinathan, 1994 .

A study of the reactions between rooftop test and expansion functions in inhomogeneously-filled stripline structures

Qiang Li, J. L. Prince, Xing Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Reaction analysis in stripline circuits

J. L. Prince, Steven L. Dvorak, S. Kabir, 2001 .

Simultaneous switching ground noise calculation for packaged CMOS devices

J. L. Prince, R. Senthinathan, 1991 .

Method of moment reaction analysis in stripline circuits

J. L. Prince, Steven L. Dvorak, S. Kabir, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Modeling and simulation of package and interconnects

J. L. Prince, J. Prince, 1994, Proceedings of IEEE Bipolar/BiCMOS Circuits and Technology Meeting.

A knowledge-based simulation environment for the early design of multichip modules

J. L. Prince, R. Senthinathan, Jerzy W. Rozenblit, 1994 .

Relevance of microelectronic education to industrial needs

J. L. Prince, J. W. Lathrop, 1977 .

Signal propagation over perforated reference planes in stripline interconnect structures

J. L. Prince, R. Senthinathan, W. E. Pence, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Considerations for accurately determining the maximum power output of solar cells

J. L. Prince, J. W. Lathrop, 1979 .

Application specific CMOS output driver circuit design techniques to reduce simultaneous switching noise

J. L. Prince, R. Senthinathan, J. Prince, 1993 .

An integrated system for design automation of VLSI interconnects and packaging

J. L. Prince, Jerzy W. Rozenblit, S. N. Pratapneni, 1993, Proceedings of 36th Midwest Symposium on Circuits and Systems.

Pole-residue formulation for transient simulation of high-speed interconnects using Householder LS curve-fitting techniques

Li Zhao, J. L. Prince, K. L. Virga, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Investigation of power/ground plane resonance reduction using lumped RC elements

J. L. Prince, K. L. Virga, G. W. Peterson, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Transmission line simulator as a basic component of CAD system for VLSI interconnects

J. L. Prince, O. A. Palusinski, J. C. Liao, 1990, Ninth Annual International Phoenix Conference on Computers and Communications. 1990 Conference Proceedings.

Computer aided design system for VLSI interconnections

J. L. Prince, Jerzy W. Rozenblit, Olgierd A. Palusinski, 1989, Proceedings 1989 IEEE International Conference on Computer Design: VLSI in Computers and Processors.

Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures

Gerardo Aguirre, J. L. Prince, K. L. Virga, 2002 .

Modeling and simulation of coupled lossy lines for VLSI interconnections

J. L. Prince, Andreas C. Cangellaris, Olgierd A. Palusinski, 1988, Proceedings 1988 IEEE International Conference on Computer Design: VLSI.

Thermal performance evaluation of VLSI packaging

J. L. Prince, Z. J. Staszak, B. R. Simon, 1989, Proceedings. VLSI and Computer Peripherals. COMPEURO 89.

Methods to reduce radiation from split ground plane structures [packaging]

Gerardo Aguirre, J. L. Prince, K. L. Virga, 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).

Low-cost, high performance optoelectronic components for antenna remoting

J. L. Prince, H. V. Roussell, E. I. Ackerman, 1998 .

A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections

J. L. Prince, Andreas C. Cangellaris, C. E. Abernethy, 1995 .

Development of an accelerated reliability test schedule for terrestrial solar cells

J. L. Prince, J. W. Lathrop, 1981 .

Design of controlled slew rate CMOS output driver and optimum package-pin placement to minimize the "effective" power/ground switching noise

J. L. Prince, R. Senthinathan, 1992, [1992 Proceedings] Electrical Performance of Electronic Packaging.

Comparisons of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations

Andreas C. Cangellaris, J. L. Prince, Sm Shajedul Hasan, 2000 .

Delay time estimate for "FAST" CMOS drivers with noisy ground reference

J. R. Brews, J. L. Prince, Yaochao Yang, 1995, Proceedings of Electrical Performance of Electronic Packaging.

A simplified random vibration analysis on portable electronic products

J. L. Prince, W. Huang, D. B. Kececioglu, 2000 .

Electrical modeling and simulation issues in ULSI packaging

J. L. Prince, 1992, IEEE Antennas and Propagation Society International Symposium 1992 Digest.

Simulation of transients in VLSI packaging interconnections

Andreas C. Cangellaris, J. L. Prince, J. C. Liao, 1989 .

Effect of mutual coupling between signal traces and ground planes on SSO noise in packages with multiple stacked ground planes

J. L. Prince, A. M. Yaghmour, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

A new dispersive, hybrid phase-pole macromodel for frequency-dependeut lossy transmission lines

J. L. Prince, Steven L. Dvorak, Bing Zbong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

An automatic network generator for design verification of electronic packages

J. L. Prince, N. Cherukuri, 1995, Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).

Computation of transients in lossy VLSI packaging interconnections

J. L. Prince, Olgierd A. Palusinski, J. C. Liao, 1990 .

Modeling of simultaneous switching ground noise for gallium arsenide DCFL drivers

J. L. Prince, 1996 .

Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design

J. L. Prince, Andreas C. Cangellaris, Cheng Jiao, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Influence of parameter distribution on simultaneous switching noise (SSN) for CMOS output drivers

J. L. Prince, A. Vaidyanath, J. Prince, 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

Second quadrant effects in silicon solar cells

J. L. Prince, J. W. Lathrop, R. A. Hartman, 1980 .

UASSNS 3.1: an integrated design and analysis tool for SSO noise in leadframe packages

J. L. Prince, Lei Lin, Chender Huang, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

J. L. Prince, A. C. Cangellaris, M. Lopez, 1999, ECTC 1999.

Effect of CMOS driver loading conditions on simultaneous switching noise

J. L. Prince, B. Thoroddsen, A. Vaidyanath, 1994 .

Modeling of simultaneous switching ground noise for BiCMOS drivers

J. L. Prince, D. A. Seeker, 1995, Proceedings of Electrical Performance of Electronic Packaging.

Role of driver loading conditions on simultaneous switching noise

J. L. Prince, A. Vaidyanath, B. Thoroddsen, 1993, Proceedings of IEEE Electrical Performance of Electronic Packaging.

Foreword contributions from the 10th topical meeting on electrical performance of electronic packaging

J. L. Prince, G. Katopis, 2002 .

Development of chip model library for the computer-aided analysis of electronic packages

Jerzy W. Rozenblit, J. L. Prince, C. M. Wolff, 1993, Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium.

Exploration of a new, efficient approach to modeling and simulation of interconnects

J. L. Prince, Steven L. Dvorak, Bing Zhong, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Development of a time-domain simulation methodology for the hybrid phase-pole interconnect macromodel

J. L. Prince, Steven L. Dvorak, Bing Zhong, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Modeling the performance of embedded gridded plane structures in LTCC

G. Winkler, J. L. Prince, K. L. Virga, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Packaging design support environment-a simulation system for analysis of VLSI interconnects

Jerzy W. Rozenblit, J. L. Prince, O. A. Palusinski, 1990, Ninth Annual International Phoenix Conference on Computers and Communications. 1990 Conference Proceedings.

Frequency response characteristics of reference plane effective inductance and resistance [IC packaging]

J. L. Prince, Xuebing Xie, 1999 .

Thermal wake models for forced air cooling of electronic components

J. L. Prince, Alfonso Ortega, J. D. Chicci, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Experimental thermal characterization of VLSI packages

J. L. Prince, Z. J. Staszak, D. Shope, 1988, Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

On the deeply depleted MOS capacitor

J. L. Prince, J. J. Wortman, J. Wortman, 1970 .

X- and gamma-ray hardness of floating-gate EEPROM technology as applied to implantable medical devices

J. L. Prince, L. J. Stotts, L. Stotts, 1999 .

A study of the fields associated with horizontal dipole sources in stripline circuits

J. L. Prince, Steven L. Dvorak, S. Dvorak, 2002 .

Effects and modeling of simultaneous switching noise for BiCMOS off-chip drivers

J. L. Prince, D. A. Secker, 1996 .

The per-unit-length capacitance matrix of flaring VLSI packaging interconnections

J. L. Prince, Andreas C. Cangellaris, A. A. Omer, 1991 .

A boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate

J. L. Prince, Alfonso Ortega, Cho Lik Chan, 1994 .

Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints

Cemal Basaran, J. L. Prince, Terrance J. Dishongh, 1998 .

A parameteric study of the attenuation constant of lossy microstrip lines

J. L. Prince, Andreas C. Cangellaris, L. P. Vakanas, 1990 .

Thermal and mechanical finite element analysis of a VLSI package including spatially varying thermal contact resistance

J. L. Prince, J. R. Umaretiya, B. R. Simon, 1990, Sixth Annual IEEE Proceedings Semiconductor Thermal and Temperature Measurement Symposium.

Characterization of frequency dependent dielectric packaging media using differential and multiple-reflection techniques on a precision stripline test structure

J. L. Prince, K. L. Virga, C. C. Green, 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).