Johan Liu

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Zhaonian Cheng, Yan Zhang, Teng Wang, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni (P) metallization

Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, 56th Electronic Components and Technology Conference 2006.