Russ Dudley

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration

Wei Wang, David Grant, M. O'Brien, 2009, 2009 IEEE International Conference on 3D System Integration.

Inspection and Metrology Solutions from TSV through Reveal for High Volume Manufacturing

Rajiv Roy, Matt Wilson, David Marx, 2013 .

Wafer Thickness Sensor (WTS) for etch depth measurement of TSV

David Grant, David Marx, Russ Dudley, 2009, 2009 IEEE International Conference on 3D System Integration.