Chung-Daw Young

Bonding mechanism of electroless Ni-P film with AlN substrate and Cu foil

Jenq-Gong Duh, Chung-Daw Young, C. Young, 1998 .

Generation mechanism and reduction methods of post-passivation-etch silklike polymers

Chung-Daw Young, Sen-Fu Chen, Chia-Hsiang Chen, 1999, Other Conferences.