Augustin Coello-Vera

New ultrathin 3D integration technique: technological and thermal investigations

Olivier Vendier, Eric Beyne, Santiago Marco, 2000, Design, Test, Integration, and Packaging of MEMS/MOEMS.

Residual thermomechanical stresses in ultrathin chip stack technology

Olivier Vendier, Eric Beyne, Santiago Marco, 2000, Design, Test, Integration, and Packaging of MEMS/MOEMS.

Residual thermomechanical stresses in thinned-chip assemblies

Olivier Vendier, Eric Beyne, S. Pinel, 2000 .