J. Schutt-Aine

Transient simulation of lossy interconnects using the Latency Insertion Method (LIM)

D. Klokotov, J. Schutt-Aine, 2008, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging.

Packaging education for the 21st century

E. Michielssen, J. Schutt-Aine, A. Cangellaris, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

A novel low-cost pluggable chip scale package for high pin-count applications

J. Schutt-Aine, A. Cangellaris, S.W. Crane, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Signal integrity education on the Web

J. Schutt-Aine, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).