Ming-Lin Li

Electrical testing of blind Through-Silicon Via (TSV) for 3D IC integration

P. Tzeng, M. Kao, W. Lo, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications

John H. Lau, Ming-Jer Kao, Shyh-Shyuan Sheu, 2012 .