F. Murray

Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools

F. Roozeboom, F. Murray, F. LeCornec, 2007, 2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization

F. Murray, 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..