Maryse Paoli

STI process steps for sub-quarter micron CMOS

M. Haond, P. Sallagoity, F Gaillard, 1998 .

Two-layer resist etchback planarization process coupled to chemical mechanical polishing for sub-0.18-μm shallow trench isolation technology

Alain Prola, Maurice Rivoire, Andre Schiltz, 1999, Advanced Lithography.