Changxue Wang

发表

Stochastic models for material removal rate (MRR) in chemical mechanical planarization (CMP) process

Changxue Wang, 2004 .

Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation

Peter Sherman, Abhijit Chandra, Changxue Wang, 2005, Int. J. Manuf. Technol. Manag..

Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization

David Dornfeld, Abhijit Chandra, Changxue Wang, 2005 .