G. Takyi

Optimisation of Reflow Profile of Surface Mount Assembly Using Taguchi Design of Experiments

G. Takyi, P. K. Bernasko, 2015 .

Investigation Of The Effects Of Reflow Profile Parameters On Lead‐free Solder Bump Volumes And Joint Integrity

Ndy Ekere, G. Takyi, R. S. Bhatti, 2011 .

Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method

Emeka H. Amalu, Ndy Ekere, G. Takyi, 2015 .

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Emeka H. Amalu, Ndy Ekere, Sabuj Mallik, 2011 .